JPH0151214B2 - - Google Patents

Info

Publication number
JPH0151214B2
JPH0151214B2 JP56043083A JP4308381A JPH0151214B2 JP H0151214 B2 JPH0151214 B2 JP H0151214B2 JP 56043083 A JP56043083 A JP 56043083A JP 4308381 A JP4308381 A JP 4308381A JP H0151214 B2 JPH0151214 B2 JP H0151214B2
Authority
JP
Japan
Prior art keywords
case
electrical component
lid
electrical
dish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56043083A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56149815A (en
Inventor
Pirutsu Deiitaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6098424&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0151214(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS56149815A publication Critical patent/JPS56149815A/ja
Publication of JPH0151214B2 publication Critical patent/JPH0151214B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Casings For Electric Apparatus (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP4308381A 1980-03-26 1981-03-24 Electric part case Granted JPS56149815A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3011730A DE3011730C2 (de) 1980-03-26 1980-03-26 Gehäuse für elektrische Bauelemente, Bauelementegruppen oder integrierte Schaltungen

Publications (2)

Publication Number Publication Date
JPS56149815A JPS56149815A (en) 1981-11-19
JPH0151214B2 true JPH0151214B2 (en]) 1989-11-02

Family

ID=6098424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4308381A Granted JPS56149815A (en) 1980-03-26 1981-03-24 Electric part case

Country Status (5)

Country Link
US (1) US4369330A (en])
EP (1) EP0036671A1 (en])
JP (1) JPS56149815A (en])
DE (1) DE3011730C2 (en])
HU (1) HU182311B (en])

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
DE3131019C2 (de) * 1981-08-05 1985-04-11 Standard Elektrik Lorenz Ag, 7000 Stuttgart Elektromagnetisches Relais
US4677526A (en) * 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
EP0157938A3 (de) * 1984-03-23 1987-05-13 Siemens Aktiengesellschaft Gehäuse für elektrische Bauelemente
DE3512628A1 (de) * 1984-04-11 1985-10-17 Moran, Peter, Cork Packung fuer eine integrierte schaltung
DE3539518A1 (de) * 1985-11-07 1987-05-14 Siemens Ag Anschlusselemente, insbesondere anschlussfahnen fuer auf traeger angeordnete umhuellte elektrische bauelemente, bauelementegruppen oder integrierte schaltungen, insbesondere oberflaechenwellenfilter
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
JPS62131482U (en]) * 1986-02-12 1987-08-19
US4751611A (en) * 1986-07-24 1988-06-14 Hitachi Chemical Co., Ltd. Semiconductor package structure
EP0342390B1 (de) * 1988-05-17 1993-02-17 Siemens Aktiengesellschaft Gehäuse für elektrische Bauelemente, Bauelementegruppen oder integrierte Schaltungen
JP2612339B2 (ja) * 1989-04-18 1997-05-21 三菱電機株式会社 電子機器筐体
DE8912130U1 (de) * 1989-10-12 1989-11-23 Hella KG Hueck & Co, 4780 Lippstadt Gehäuse für ein elektromagnetisches Bauelement, insbesondere Relais
JPH0422762A (ja) * 1990-05-16 1992-01-27 Mitsubishi Electric Corp イグナイタ
WO1992002040A1 (en) * 1990-07-25 1992-02-06 Dsm N.V. Package for incorporating an integrated circuit and a process for the production of the package
GB9018762D0 (en) * 1990-08-28 1990-10-10 Lsi Logic Europ Encapsulation of electronic components
US5537342A (en) * 1990-08-28 1996-07-16 Lsi Logic Corporation Encapsulation of electronic components
GB2253309A (en) * 1990-08-28 1992-09-02 Lsi Logic Europ Encapsulation of electronic components
DE4224103A1 (de) * 1992-07-22 1994-01-27 Manfred Dr Ing Michalk Miniaturgehäuse mit elektronischen Bauelementen
WO1994016460A1 (en) * 1993-01-15 1994-07-21 Vilyam Lazarevich Sanderov Integrated microcircuit
US5448014A (en) * 1993-01-27 1995-09-05 Trw Inc. Mass simultaneous sealing and electrical connection of electronic devices
US5557144A (en) * 1993-01-29 1996-09-17 Anadigics, Inc. Plastic packages for microwave frequency applications
DE4325942C2 (de) * 1993-08-03 1995-05-18 Duerrwaechter E Dr Doduco Hybridrahmen
DE4428319C2 (de) * 1994-08-10 1996-08-14 Duerrwaechter E Dr Doduco Träger aus einem Kunststoff für eine elektronische Schaltung mit bondbaren Kontaktstiften
USD387735S (en) * 1995-03-23 1997-12-16 Pilz CmbH & Co. Housing for electrical components
US6340792B1 (en) * 1997-04-30 2002-01-22 Nec Corporation Mold cap for semiconductor device mold package
JP3888228B2 (ja) * 2002-05-17 2007-02-28 株式会社デンソー センサ装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3501582A (en) * 1968-04-18 1970-03-17 Burroughs Corp Electrical assembly
US3737729A (en) * 1971-06-14 1973-06-05 Zeltex Inc Electronic package and method of construction
US3806766A (en) * 1972-12-27 1974-04-23 Western Electric Co Packaged electrical component assembly and method of fabrication
US3838316A (en) * 1973-10-09 1974-09-24 Western Electric Co Encapsulated electrical component assembly and method of fabrication
DE2610172C3 (de) * 1975-03-12 1980-08-21 Murata Manufacturing Co., Ltd., Nagaokakyo, Kyoto (Japan) Filter auf der Basis der akustischen Oberflächenwellen
GB1512593A (en) * 1975-03-13 1978-06-01 Murata Manufacturing Co Elastic surface wave filter
DE7735936U1 (de) * 1976-11-30 1978-03-09 Sds-Elektro Gmbh, 8024 Deisenhofen Gehäuse für ein elektrisches Bauelement
JPS588582B2 (ja) * 1977-04-22 1983-02-16 三菱電機株式会社 トランジスタ用同軸形パツケ−ジ
CH625381A5 (en]) * 1977-12-02 1981-09-15 Standard Telephon & Radio Ag
US4139726A (en) * 1978-01-16 1979-02-13 Allen-Bradley Company Packaged microcircuit and method for assembly thereof
JPS54129802A (en) * 1978-03-30 1979-10-08 Omron Tateisi Electronics Co Manufacture for sealed type electric apparatus
JPS5914894B2 (ja) * 1978-08-03 1984-04-06 日本碍子株式会社 セラミツクパツケ−ジ
US4272644A (en) * 1979-09-27 1981-06-09 Hybrid Systems Corporation Electronic hybrid circuit package

Also Published As

Publication number Publication date
DE3011730C2 (de) 1982-05-27
JPS56149815A (en) 1981-11-19
EP0036671A1 (de) 1981-09-30
US4369330A (en) 1983-01-18
HU182311B (en) 1983-12-28
DE3011730A1 (de) 1981-10-01

Similar Documents

Publication Publication Date Title
JPH0151214B2 (en])
US4012579A (en) Encapsulated microcircuit package and method for assembly thereof
US6396201B1 (en) Piezoelectric vibrator
US20090026372A1 (en) Infrared sensor and method for manufacturing infrared sensor
JPS60260143A (ja) 集積回路用パツケ−ジ
JPH10170380A (ja) 半導体センサ装置
US5436407A (en) Metal semiconductor package with an external plastic seal
US4047129A (en) Elastic surface wave filter
WO2022111133A1 (zh) 气压传感组件及其封装方法
CN112881813B (zh) 一种可改善光学电场传感器输出噪声的封装管壳
JP3755540B2 (ja) 電子回路容器
JP2009164362A (ja) 固体撮像装置及びその製造方法
JP6780675B2 (ja) 半導体装置及び半導体装置の製造方法
CN114136533A (zh) 一种压力传感器的封装结构和封装方法
JP3463381B2 (ja) 表面実装型電子部品の製造方法
JPH0218994A (ja) 電気デバイスまたは集積回路用ケース
JPH0329742Y2 (en])
JPS61145851A (ja) 半導体モジユ−ル
JP2002296136A (ja) 変換器のケース構造
JPS5710253A (en) Semiconductor device
JPS597769Y2 (ja) 弾性表面波装置
JPH036027Y2 (en])
JPH0535235Y2 (en])
JP2571795Y2 (ja) 樹脂封止形電子部品
JPS58154250A (ja) 混成集積回路